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| Ceramic PCB Production Capacity | ||
| Item | Name | Production |
| 1 | Ceramic PCB material brand | MARUWA Japan,Fujian Huaqing,Sinoceram Technology |
| 2 | Ceramic PCB material | 96% alumina(Al2O3) ceramics substrate Aluminum nitride(AlN) ceramics substrate |
| 3 | Ceramic PCB material Size | 114*114mm 120*120mm 140*130mm 190*140mm |
| 4 | Material Thickness | 0.2mm,0.25mm,0.3mm,0.38mm,0.5mm,0.635mm,0.8mm,1.0mm,1.2mm,1.5mm |
| 5 | Production technology | DPC (copper plating) 0.5~10 oz LTCC (Silver Paste) DBC (ceramic copper foil high-temperature bonding) |
| 6 | Layers | 1layer 2layers |
| 7 | Copper Weight(OZ) | H/H,1/1,2/2,3/3,4/4,5/5,6/6,7/7,8/8,9/9,10/10 |
| 8 | Min.Line width/Spacing | 0.1mm/0.1mm |
| 9 | Min.Drilling holes | 0.06mm |
| 10 | Holes tolerance | 20% |
| 11 | Drilling shift Angle | +/-0.025mm |
| 12 | Slot holes tolerance | L≥2XW: long +/-0.05mm, wide +/-0.025mm |
| L< 2XW: long +/-0.025mm wide +/-0.010mm | ||
| 13 | Soldermask thickness | 15um |
| 14 | Soldermask Tolerance | ±0.05mm |
| 15 | Min.Line for soldermask | 1OZ-0.05mm |
| 2OZ-0.075mm | ||
| 3OZ-0.1mm | ||
| 4OZ-0.125mm | ||
| 16 | Min.Pad soldermask opening | 0.15mm |
| 17 | Silkscreen | Min.Silkscreen width 0.15mm |
| Silkscreen to pad, 0.15mm | ||
| Min.Dia silkscreen 0.75mm | ||
| Min.Gap silkscreen 0.15mm | ||
| 18 | Immersion Gold thickness | 0.01-0.075um |
| 19 | Immersion Silver thickness | 2-5um |
| 20 | Laser outline | Cutting Line to Line 0.5mm |
| Residual thickness torelance: ±0.05mm | ||
| Position tolerance: ±0.025mm | ||
| Cutting line to cutting line tolerance:±0.025mm | ||
| Laser outline tolerance +/-0.1mm | ||
| 21 | Thermal conductivity | 96% alumina(Al2O3) 20~27 W/m·K Aluminum nitride(AlN) 180~220 W/m·K |
| 22 | Bow and twist(mm) | 3‰(each 100mm is 0.3mm) |