Description
Dickson Circuit is a high-tech company which produce IC substrate PCB. We can do IC packing LGA, UDP, FCBGA, BGA etc.
We offer high quality IC substrate. Lead time of IC substrate is 15 days for prototype, 25-40 days for mass production.
We follow strict testing control procedure on IC substrate. Our Product yield reached above 95%.
Few professional companies can produce IC substrate in Shenzhen.Dickson Circuit is the best choice.
IC substrate Capacity
Item |
IC substrate Specifications |
| IC substrate Materials |
Shengyi,BT,Mitsubishi,Doushan,Toshiba,LG,Ajinomoto Buildup Film(ABF) |
| |
MASS Production |
Samples Production |
| Layer |
2-6layer |
2-10layer |
| Min Drilling |
100um |
100um |
| Bonding Finger |
Min.Pitch |
105um |
95um |
| Min.Width |
35um |
35um |
| Circuit Line |
Min.Pitch |
95um |
25um |
| Min.Width |
25um |
25um |
| Min.Spacing |
25um |
25um |
| Min.Weding ring |
80um |
80um |
| Min.Thickness |
2L |
100um |
100um |
| 4L |
300um |
200um |
| 6L |
400um |
300um |
| Line to PAD/EDGE |
100um |
100um |
| Soldermask |
Solder PAD |
50um |
50um |
| Solder DAM |
80um |
70um |
| Thickness |
20+/-5um |
20+/-5um |
| Flatness |
5um |
5um |
| Surface Finish |
Hard Gold |
Ni: 5-15 µm,Au: 0.2-0.5 µm |
Ni: 5-15 µm,Au: 0.2-2 µm |
| Soft Gold |
Ni: 5-15 µm,Au: 0.3-0.8 µm |
Ni: 5-15 µm,Au: 0.3-2 µm |
| ENEPIG-WB |
Ni: 3-8 µm,Pd: 0.1-0.2 µm,Au: 0.1-0.2 µm |
Ni: 3-8 µm,Pd: 0.1-0.2 µm,Au: 0.1-2µm |
| ENEPIG-SMT |
Ni: 3-8 µm,Pd: 0.05-0.15 µm,Au: 0.05-0.15 µm |
Ni: 3-8 µm,Pd: 0.05-0.15 µm,Au: 0.05-2 µm |
| OSP |
OSP: 0.1-0.3 µm |
OSP: 0.1-0.3 µm |
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